Invention Application
- Patent Title: CLAMP ON BONDING JUMPER
- Patent Title (中): CLAMP ON BOUNING JUMPER
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Application No.: PCT/US2017/047096Application Date: 2017-08-16
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Publication No.: WO2018057152A1Publication Date: 2018-03-29
- Inventor: MARTIN, Evan, Ronald
- Applicant: HUBBELL INCORPORATED
- Applicant Address: 40 Waterview Drive Shelton, CT 06484 US
- Assignee: HUBBELL INCORPORATED
- Current Assignee: HUBBELL INCORPORATED
- Current Assignee Address: 40 Waterview Drive Shelton, CT 06484 US
- Agency: WISSING, Gerard, M.
- Priority: US62/398,729 20160923
- Main IPC: H01R4/38
- IPC: H01R4/38 ; H01R4/32 ; H01R4/36 ; H01R4/64 ; H01R4/28
Abstract:
A bonding jumper system includes a clamp capable of clamping a bonding jumper to a structure and a clamp bolt operationally associated with the clamp, the clamp bolt further including a ground post for attaching a ground cable.
Information query
