A connector for surface mounting with a solder reflow process with solder masses fused to mounting ends of contacts exposed in a mounting surface of the connector. The solder masses may be attached to edges of the mounting ends using a pin transfer method to apply flux to the edges. The edges may have a concave shape to both increase the length of the edge to which the solder masses are attached and position the solder masses with respect to the mounting ends. Solder paste may be omitted in attaching the solder balls to the contacts, reducing the capacitance of the contact and promoting uniformity of the impedance of the signal paths through the mounting interface of the connector.