A reconfigurable photoconductive electrical wiring chip, according to one embodiment of the present invention, comprises: a plurality of conductive patterns arranged on a substrate so as to be spaced apart from each other; a first photoconductive layer arranged between the conductive patterns; and a second photoconductive layer arranged on the conductive patterns. The first photoconductive layer electrically connects the conductive patterns by means of light irradiation of a first illumination pattern, and the second photoconductive layer operates as a photoconductive electrode which electrically connects the conductive patterns or the first photoconductive layer in a direction perpendicular to the substrate by means of light irradiation of a second illumination pattern, so as to provide an electric wiring to an object arranged on the second photoconductive layer.