- 专利标题： RESIN COMPOSITIONS AND RESIN INFUSION PROCESS
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申请号： PCT/US2018/056986申请日： 2018-10-23
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公开(公告)号： WO2019083921A3公开(公告)日： 2019-05-02
- 发明人: MEEGAN, Jonathan, E. , AURILIA, Marco
- 申请人： CYTEC INDUSTRIES INC.
- 申请人地址： 504 Carnegie Center Princeton, NJ 08540 US
- 专利权人： CYTEC INDUSTRIES INC.
- 当前专利权人： CYTEC INDUSTRIES INC.
- 当前专利权人地址： 504 Carnegie Center Princeton, NJ 08540 US
- 代理机构： DANG, Thi, D. et al.
- 优先权： GB1717639.7 20171026
- 主分类号： C08G59/22
- IPC分类号： C08G59/22 ; C08G59/32 ; C08G59/38 ; C08G59/50 ; C08L63/00 ; B29C70/48 ; C08G59/18 ; C08G59/26
摘要：
Curable epoxy resin compositions suitable for liquid resin infusion processes. In one embodiment, the resin composition contains (a) at least two polyepoxides, one of which is triglycidyl ether of tris(hydroxyphenyl)methane, (b) an aromatic amine curing agent, and (c) core-shell rubber particles. In another embodiment, the resin composition (a) at least two polyepoxides, one of which is diglycidyl ether of bis(hydroxyphenyl)fluorene, (b) an aromatic amine curing agent, and (c) core-shell rubber particles.
IPC分类:
