A method of manufacturing a multi-layer circuit includes providing a first layer (11, 15) with an insulating substrate (11) and conductors (15, 16). This may ultimately form an external layer for a circuit. A solder mask (30, 31) is applied to expose conductor areas (19, 20) to provide component pads. Solder paste (42) is deposited in mask openings to provide solder deposits on the component pads. Components (40, 41) are placed on the solder paste deposits. The solder paste is caused to reflow by heating and it is cooled to cure the solder to secure the components in place. One or more solid resin layers (50) with holes (60) for the components (40) are placed over the first layer, and the assembly is pressed to cause flow of resin (53) from the resin layer or layers (50) around the components to encapsulate the components.