A circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness is disclosed. A circuit pattern continuous manufacturing device comprises: an unwinder for unwinding a transfer film into a state of being unfolded in a horizontal direction; a rotary drum-type continuous electroforming part for forming, on the surface of a rotating cathode drum, a circuit pattern having a first metal layer by means of electroplating; a continuous transfer part for transferring, onto the transfer film, the circuit pattern formed on the surface of the cathode drum of the rotary drum-type continuous electroforming part; a first turn bar for changing the transfer film from the horizontally unfolded state into a vertically upright state; a first vertical plating bath for plating a second metal layer, made of metal which is the same material as that of the continuous electroforming part, on the circuit pattern transferred on the transfer film which is changed in a vertical direction and moved; and a rewinder for rewinding the transfer film.