The present invention relates to an apparatus (100) for applying an adhesive film (200) on a plate-like element (300). The apparatus (100) comprises a support frame (10), transport means (16) adapted to move the plate-like element (300) toward a work head (18) comprising a work surface (28) operatively adapted to receive the adhesive film (200) and to press the latter on the substrate surface (310) at a contact line (C), and cutting means (52). Specifically, the work surface (28) comprises a first contact portion (36) and a second contact portion (38) at least partially separated from each other by a through opening (44). The work head (18) also comprises reversible holding means (46) and said cutting means (52) are provided with at least a cutting element (54) adapted to slidingly engage the through opening (44). The work head (18) is also adapted to rotate about a rotation axis (R) between a first position and a second position in which respectively at least a part of one of the first contact portion (36) and the second contact portion (38) operatively presses on the substrate surface (310) at the contact line (C).