The present invention addresses the problem of providing a mixture member comprising SiC and Si, which can be formed without the need to use a resin as a medium and regardless of the form thereof. The mixture member comprising SiC and Si (SiC/Si mixture member (10)) for solving the problem is characterized in that a chip-like or powder-like SiC member (filler (14)) is dispersed in the inside of an Si member (base material (12)) having a polycrystalline structure. The SiC/Si mixture member (10) having this characteristic property may be configured in such a manner that a SiC coat layer (16) is provided on the surface thereof.