利索-全球专利检索

  1. 登录
  2. 注册
发明申请
WO2021196510A1 一种高导热电气绝缘封装料及其制备方法 审中-公开

一种高导热电气绝缘封装料及其制备方法
摘要：
本发明提供了一种高导热电气绝缘封装料及其制备方法。具体的，本发明所提供的封装料是由亚胺环氧树脂SRTEM-80、含特丁基缩水甘油醚环氧树脂REDG-80、双酚A二缩水甘油醚环氧树脂、活性增韧剂、固化剂、偶联剂和导热无机填料组成的混合物；其次，本发明还提供了所述高导热电气绝缘封装料的制备方法，所述方法制备工艺简单、环境友好、所得产品综合性能优异，非常适合于IGBT的封装，具有良好的应用前景。
摘要（英）：

The present invention provides a high thermal conductivity electrical insulation packaging material and a preparation method therefor. Specifically, the packaging material provided by the present invention is a mixture composed of an imine epoxy resin SRTEM-80, a tert-butyl glycidyl ether-containing epoxy resin REDG-80, a bisphenol A diglycidyl ether epoxy resin, an active toughening agent, a curing agent, a coupling agent and a thermally conductive inorganic filler. Further, the present invention also provides a method for preparing the high thermal conductivity electrical insulation packaging material. The method has simple preparation process, and is environmentally friendly. The obtained product has excellent comprehensive performance, is suitable for IGBT packaging, and has good application prospects.

0/0