An assembly (1) for protecting an SMD component (2) from environmental influences is described comprising at least one SMD component (2), a metallic wiring (4) adapted and arranged to lead current from the at least one SMD component (2) to an external circuit, at least one protection element (5) adapted and arranged to cover all outer surface (6) of the SMD component (2) and at least parts of the metallic wiring (4), wherein the assembly (1) has a structure of a molded module, and wherein the at least one SMD component (2) comprises a rechargeable all solid-state battery. Furthermore, a method for preparing an assembly (1) for protecting an SMD component (2) from environmental influences is described.