Invention Application
- Patent Title: PARALLELIZED MAGNETIC SENSING OF SAMPLES USING SOLID-STATE SPIN SYSTEMS
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Application No.: PCT/EP2021/060736Application Date: 2021-04-23
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Publication No.: WO2021219516A1Publication Date: 2021-11-04
- Inventor: DEEG, Andreas
- Applicant: TECHNISCHE UNIVERSITÄT MÜNCHEN
- Applicant Address: Arcisstraße 21
- Assignee: TECHNISCHE UNIVERSITÄT MÜNCHEN
- Current Assignee: TECHNISCHE UNIVERSITÄT MÜNCHEN
- Current Assignee Address: Arcisstraße 21
- Agency: LUCKE, Andreas
- Priority: EP20172145.3 2020-04-29
- Main IPC: G01R33/32
- IPC: G01R33/32 ; G01R33/30 ; G01N24/10 ; G01R33/60 ; B01L3/00 ; G01N21/64 ; G01R33/032 ; B01L2300/0654 ; B01L3/5085 ; G01R33/323
Abstract:
Disclosed herein is a sensor chip for parallelized magnetic sensing of a plurality of samples, a system for parallelized magnetic sensing of a plurality of samples and a method for probing a plurality of samples using optically addressable solid-state spin systems. The sensor chip comprises an optically transparent substrate comprising a plurality of optically addressable solid-state spin systems arranged in a plurality of sensing regions in a surface layer below a top surface of the substrate. The sensor chip further comprises a plurality of sample sites, wherein each sample site is arranged above a respective sensing region. The sensor chip has a light guiding system configured to provide an optical path through the substrate connecting each of the sensing regions.
Information query