Invention Application
- Patent Title: WAFER BIN MAP BASED ROOT CAUSE ANALYSIS
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Application No.: PCT/US2021/030306Application Date: 2021-04-30
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Publication No.: WO2021222836A1Publication Date: 2021-11-04
- Inventor: HONDA, Tomonori , CHEONG, Lin, Lee , BURCH, Richard , ZHU, Qing , DAVID, Jeffrey, Drue , KELEHER, Michael
- Applicant: PDF SOLUTIONS, INC.
- Applicant Address: 2858 De La Cruz Boulevard
- Assignee: PDF SOLUTIONS, INC.
- Current Assignee: PDF SOLUTIONS, INC.
- Current Assignee Address: 2858 De La Cruz Boulevard
- Agency: NEBB, Richard, A.
- Priority: US63/018,884 2020-05-01
- Main IPC: G01N31/00
- IPC: G01N31/00 ; G01F19/00 ; H01L21/66
Abstract:
A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.
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