The present invention relates to a heating system component (18), comprising a carrier unit (26) having a dry side (38), a wet side (40), a groove (34) provided on the dry side (38), and a medium leading section (42) at least partially opposite a medium flow area on the wet side (40); a heating unit (28) at least partially received in the groove (34); a heat conducting plate assembly (46) that comprises a first heat capturing plate portion (54) that is thermally coupled to the heating unit (28), a second heat capturing plate portion (56) that is thermally coupled to the medium leading section (42) of the carrier unit (26), a first heat releasing plate portion (58), and a second heat releasing plate portion (60); at least one printed circuit board (48) comprising circuitry (70) with a first sensor area (72) and a second sensor area (74), wherein the circuitry (70) is configured to sense a first temperature at the first sensor area (72) and a second temperature at the second sensor area (74); a housing (50) accommodating at least a part of the printed circuit board (48) and at least a part of the heat conducting plate assembly (46) in such a way that the first sensor area (72) is thermally coupled to the first heat releasing plate portion (58) and the second sensor area (74) is thermally coupled to the second heat releasing plate portion (60).