Invention Application
- Patent Title: THERMAL INTERFACE MATERIALS WITH RUBBER COMPATIBILITY
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Application No.: PCT/US2022/027686Application Date: 2022-05-04
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Publication No.: WO2022235812A1Publication Date: 2022-11-10
- Inventor: AGARWAL, Praveen , GAMBOA, Rogelio , HOSSAIN, Mohammad Arif , KAGA, An
- Applicant: DOW GLOBAL TECHNOLOGIES LLC
- Applicant Address: 2211 H.H. Dow Way
- Assignee: DOW GLOBAL TECHNOLOGIES LLC
- Current Assignee: DOW GLOBAL TECHNOLOGIES LLC
- Current Assignee Address: 2211 H.H. Dow Way
- Agency: ZHAO, Zhiqiang
- Priority: US63/184,330 2021-05-05
- Main IPC: C08G18/08
- IPC: C08G18/08 ; C08G18/10 ; C08G18/20 ; C08G18/38 ; C08G18/48 ; C08G18/76 ; C08G18/80 ; C08K5/00 ; C08K9/06 ; C08L75/00
Abstract:
Thermally conductive compositions include a blocked isocyanate prepolymer composition containing an isocyanate prepolymer blocked with one or more of alkylphenol or alkenylphenol; and an amine composition containing: one or more polyetheramines, and one or more plasticizers selected from esters of glycol ethers; and a thermally conductive filler present at a percent by weight of the thermally conductive composition (wt%) in a range of 60 wt% to 98 wt%; wherein the thermally conductive composition cures at a temperature in the range of 18oC to 35oC when the blocked isocyanate prepolymer composition and the amine composition are mixed.
Information query