METHOD OF SUBSTRATE CHECKING, AND SUBSTRATE PROCESSING SYSTEM
Abstract:
A method of substrate checking is described. The method includes placing a substrate (10) on a substrate support (120) in a vacuum processing chamber (101); introducing a gas (20) through the substrate support into a region (150) between the substrate support and the substrate via a gas supply (130); and measuring an actual pressure in the gas supply (130) or the region (150) for determining a substrate defect or an incorrect substrate placement on the substrate support. Further, a substrate processing system (100) is described that is configured for the substrate checking method described herein.
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