A mold device includes a mold including a first mold side (110) and a second mold side (105) having a lower thermal conductivity than the first mold side (110), the first mold side (110) including a first mold insert (117) disposed on a surface of the first mold side (110), the first mold insert (117) including a plurality of inverted microstructures (199) formed thereon, the plurality of inverted microstructures (199) disposed according to a predetermined layout, wherein a thermal conductivity of the first mold side (110) is 5 to 1,500 W·m−1·K−1 at 25ºC, and a thermal conductivity of the second mold side (105) is 0.01 to 2 W·m−1·K−1 at 25ºC.