Provided is a hot melt adhesive composition, comprising: (a) from 30 to 45% by weight of at least one thermoplastic block copolymer; (b) from 0.1 to 5% by weight of at least one wax having a melting point of no less than 100℃; (c) from 5% to 20% by weight of at least one plasticizer; (d) from 20% to 55% by weight of at least one aliphatic tackifier; and (e) from 2% to 15% by weight of at least one aromatic tackifier, based on the total weight of the hot melt adhesive composition. Also provided is a use of the hot melt adhesive composition.