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1.发明公开
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公开(公告)号：EP4212848A1
公开(公告)日：2023-07-19
申请号：EP22151594.3
申请日：2022-01-14
IPC分类号： G01N9/24
摘要： The disclosed invention shows a snow density measurement instrument (B), comprising at least one illumination device (4), at least one light detector (8) and a controlling computational unit (CU), wherein the at least one illumination device (4) and the at least one light detector (8) are arranged in the interior of the snow density measurement instrument (B), which is coverable with an instrument coverplate (3) facing a snow side (S), with improved resolution and easy to use by avoiding tedious preparation work before measurements. This is reached through at least one aperture (5) in the instrument coverplate (3), allowing passage of incident near-infrared radiation (6) in a wavelength range between 800nm and 1000nm through the at least one aperture (5) to the snow side (S), while from ice particles (1) reflected radiation can be measured in the at least one light detector (8) with digital images controlled and processed by the controlling computational unit (CU) in the interior of the snow density measurement instrument (B) in a non-invasively way.
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3.发明公开
公开(公告)号：EP3913741A1
公开(公告)日：2021-11-24
申请号：EP20176083.2
申请日：2020-05-22
发明人： Houtz, Derek
摘要： The disclosed invention shows a portable stable low-mass microwave radiometer (0) for measuring microwaves in the spectral range between 1 and 300 GHz, comprising at least one patch array antenna (1) and a connected suitable electronics (2) with radio-frequency components and signal processing components, allowing more stable and more accurate measurements of brightness temperature while in particular mounted on an unmanned aerial vehicle (UAV). This is reached with a patch array antenna (1) comprising at least one patch array (10, 10') with a patch substrate layer (100, 100') of a dielectric material with a pattern of an even number of printed patches (101, 101') on a front side is printed, while printed patches (101, 101') are connected via inset-feds to striplines, wherein connector lines are connected to the striplines to be led from a backside of the patch substrate layer (100, 100') to and through a ground conductor layer (108, 108'), which is fixed to the backside of the patch substrate layer (100, 100') in a defined distance (d, d') forming an air gap (106, 106') between both layer (100, 100', 108, 108') by a multiplicity of spacers (107, 107').
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