公开(公告)号：EP1910008B1

公开(公告)日：2012-12-26

申请号：EP06776337.5

申请日：2006-07-21

申请人： Behr GmbH & Co. KG

发明人： BOGER, Snjezana, Boger ,  ENGLERT, Peter ,  GROSS, Dieter ,  PFITZER, Matthias ,  TRAUTWEIN, Ingo

IPC分类号： B23K1/19 ,  B23K1/20 ,  B23K35/00 ,  B23K35/36

CPC分类号： B23K1/0012 ,  B23K1/19 ,  B23K1/20 ,  Y10T428/25

公开(公告)号：EP1910008A1

公开(公告)日：2008-04-16

申请号：EP06776337.5

申请日：2006-07-21

申请人： Behr GmbH & Co. KG

发明人： BOGER, Snjezana, Boger ,  ENGLERT, Peter ,  GROSS, Dieter ,  PFITZER, Matthias ,  TRAUTWEIN, Ingo

IPC分类号： B23K1/19 ,  B23K1/20 ,  B23K35/00 ,  B23K35/36

CPC分类号： B23K1/0012 ,  B23K1/19 ,  B23K1/20 ,  Y10T428/25

摘要： The invention relates to a surface of an object, especially a heat exchanger, e.g. a lateral part, a wavy rib, or a tube of a heat exchanger, which is to be soldered by means of a flux layer (2). In order to improve the properties of the surface that is to be soldered, said surface is provided with at least one more layer (3; 13, 16) in addition to the flux layer (2). The at least one more layer (3; 13; 16) contains an additive which modifies the surface to be soldered, said additive being reacted in order to modify the surface when the surface that is to be soldered is soldered.