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1.
公开(公告)号:EP3887717A1
公开(公告)日:2021-10-06
申请号:EP19829366.4
申请日:2019-11-21
申请人: Corning Incorporated
IPC分类号: F21V8/00
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公开(公告)号:EP4143634A1
公开(公告)日:2023-03-08
申请号:EP21796587.0
申请日:2021-04-14
申请人: Corning Incorporated
发明人: ALLEN, Kirk Richard , DU, Guanglei , ISHIKAWA, Tomohiro , KROL, Mark Francis , KUKSENKOV, Dmitri Vladislavovich , LI, Shenping , LI, Ying , MI, Xiang-Dong , SCHREIBER, Horst Herbert Anton , VARANYTSIA, Andrii
IPC分类号: G02F1/13357 , F21V8/00
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3.
公开(公告)号:EP3100081A1
公开(公告)日:2016-12-07
申请号:EP15707449.3
申请日:2015-01-29
申请人: Corning Incorporated
摘要: The present disclosure relates to substrates having laser-induced scattering features located either on the surface of the substrate or within the substrate, along with methods of making such scattering substrates. The disclosed scattering substrates provide improved light extraction properties and may be useful in a variety of applications, such as lighting and electronic displays.
摘要翻译: 本公开涉及具有位于基板的表面或基板内的激光诱导散射特征的基板,以及制造这种散射基板的方法。 所公开的散射基底提供改进的光提取性质,并且可用于各种应用中,例如照明和电子显示器。
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公开(公告)号:EP4288830A1
公开(公告)日:2023-12-13
申请号:EP22750191.3
申请日:2022-01-26
申请人: Corning Incorporated
IPC分类号: G02F1/13357
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