公开(公告)号：EP1879716A1

公开(公告)日：2008-01-23

申请号：EP06747379.3

申请日：2006-04-20

申请人： EHWA DIAMOND IND. CO., LTD. ,  General Tool, Inc.

发明人： KIM, Soo-Kwang ,  PARK, Hee-Dong ,  KIM, Jong-Ho, 1006-1405 Joogong Apt. 908 ,  CHANG, Joon-Ho

IPC分类号： B23D61/02

CPC分类号： C22C26/00 ,  B22F2005/001 ,  B23D61/18 ,  B24D5/123 ,  B24D18/00 ,  B24D99/005 ,  B28D1/121

摘要： The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.