SEALED ELECTRICAL CONNECTOR
    4.
    发明公开

    公开(公告)号:EP4099511A1

    公开(公告)日:2022-12-07

    申请号:EP22176835.1

    申请日:2022-06-01

    摘要: Devices and methods for a sealed electrical connector are described herein. Some embodiments include a spring connecting a first PCB to a second PCB, wherein the spring includes a first end portion in contact with the first PCB, a second end portion in contact with the second PCB, and a middle portion extending between the first end portion and the second end portion, a spacer surrounding the middle portion of the spring, a first seal seated in a first groove of the spacer and in contact with the first PCB, and a second seal seated in a second groove of the spacer and in contact with the second PCB.

    ADJUSTING FOR AIR FLOW TEMPERATURE CHANGES IN AN ASPIRATING SMOKE DETECTOR

    公开(公告)号:EP4099287A1

    公开(公告)日:2022-12-07

    申请号:EP22176839.3

    申请日:2022-06-01

    IPC分类号: G08B17/10 G08B17/113

    摘要: Methods, devices, and systems for adjusting for air flow temperature changes in an aspirating smoke detector are described herein. In some examples, one or more embodiments include a blower configured to cause air to flow through the aspirating smoke detector, and a controller configured to determine a temperature of the air flowing through the aspirating smoke detector has changed by a particular amount and adjust a speed of the blower in response to compensate the air flowing through the aspirating smoke detector that has changed by the particular amount.

    ASPIRATING SMOKE DETECTOR DEVICE
    6.
    发明公开

    公开(公告)号:EP4099286A1

    公开(公告)日:2022-12-07

    申请号:EP22176834.4

    申请日:2022-06-01

    IPC分类号: G08B17/10 G08B17/113

    摘要: Devices, systems, and methods for an aspirating smoke detector device are described herein. In some examples, one or more embodiments include an aspirating smoke detector device comprising a printed circuit board (PCB), a manifold including a first flow channel and a second flow channel, a blower housing configured to receive a blower, a first sensor head housing connected to the blower housing via the first flow channel, wherein the first sensor head housing is configured to receive a first sensor head, and a second sensor head housing connected to the blower housing via the second flow channel, wherein the second sensor head housing is configured to receive a second sensor head, and a gasket configured to fluidically seal the manifold to the PCB.