公开(公告)号：EP2793407A1

公开(公告)日：2014-10-22

申请号：EP13746170.3

申请日：2013-01-24

申请人： Huawei Technologies Co., Ltd.

发明人： WEI, Lili ,  CHEN, Wen ,  WEI, Yuejun ,  JIN, Ying

IPC分类号： H04B7/14

CPC分类号： H04L47/38 ,  H04B7/15521 ,  H04L1/0002 ,  H04L47/25 ,  H04L2001/0097

摘要： Embodiments of the present invention relate to the field of communications, and provide a network coding method, a relay apparatus and a selection apparatus, which can avoid a case that a network coding system matrix is not full rank, and improve correctness of decoding. The network coding method includes: obtaining network coding information, where the network coding information includes information of a candidate network coding vector set and a candidate transmission rate set, and transmission rates in the candidate transmission rate set are in one-to-one correspondence with network coding vectors in the candidate network coding vector set; selecting a full rank network matrix according to the network coding information; and coding received source node information according to the full rank network matrix. The network coding method, relay apparatus and selection apparatus provided in the embodiments of the present invention are used for network coding.

摘要翻译： 本发明的实施例涉及通信领域，并且提供可以避免网络编码系统矩阵不是满秩的情况的网络编码方法，中继装置和选择装置，并且提高解码的正确性。 网络编码方法包括：获取网络编码信息，其中网络编码信息包括候选网络编码矢量集合和候选传输速率集合的信息，并且候选传输速率集合中的传输速率与一 候选网络编码向量集中的网络编码向量; 根据网络编码信息选择完整秩网络矩阵; 并根据满秩网络矩阵对接收的源节点信息进行编码。 在本发明的实施例中提供的网络编码方法，中继装置和选择装置用于网络编码。

公开(公告)号：EP2793407B1

公开(公告)日：2016-08-03

申请号：EP13746170.3

申请日：2013-01-24

申请人： Huawei Technologies Co., Ltd.

发明人： WEI, Lili ,  CHEN, Wen ,  WEI, Yuejun ,  JIN, Ying

IPC分类号： H04B7/155

CPC分类号： H04L47/38 ,  H04B7/15521 ,  H04L1/0002 ,  H04L47/25 ,  H04L2001/0097

公开(公告)号：EP4290771A1

公开(公告)日：2023-12-13

申请号：EP22770373.3

申请日：2022-03-10

申请人： Huawei Technologies Co., Ltd.

发明人： WU, Guoqiang ,  CHEN, Wen ,  HAN, Jinzhao ,  FENG, Zhihong

IPC分类号： H03H3/007

摘要： Embodiments of this application disclose a MEMS resonator, which is used in fields of communications, clock devices, and the like. The MEMS resonator includes a substrate, a barrier layer, a conducting layer, a dielectric isolation layer, a harmonic oscillator, a first electrical isolation structure, and a first conducting structure. The substrate and the barrier layer are combined to form a cavity, and a junction between the substrate and the barrier layer includes the conducting layer. The dielectric isolation layer is included between the conducting layer and the barrier layer. The harmonic oscillator is connected to the conducting layer and is suspended in the cavity. The conducting layer is connected to a first conducting structure that is outside the barrier layer, and a first electrical isolation structure is included between the first conducting structure and the barrier layer. The barrier layer and the dielectric isolation layer are configured to isolate the first electrical isolation structure from the cavity. In this application, the first electrical isolation structure is isolated from the cavity, to prevent hydrofluoric acid vapor from corroding the first electrical isolation structure during processing, and improve a yield of the MEMS resonator