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    MILLIMETER-WAVE ASSEMBLY
    1.
    发明公开
    MILLIMETER-WAVE ASSEMBLY 审中-实审

    公开(公告)号：EP4307483A3

    公开(公告)日：2024-04-10

    申请号：EP23213847.9

    申请日：2019-03-04

    申请人： Huawei Technologies Co., Ltd.

    发明人： KHRIPKOV, Alexander ,  LIU, Dong ,  ILVONEN, Janne ,  OU, Jian ,  TIAN, Ruiyuan ,  XU, Changnian ,  HUANG, Wei ,  MILOSAVLJEVIC, Zlatoljub ,  VAN WONTERGHEM, Jari, Kristian

    IPC分类号： H01Q1/24 ,  H01Q21/00 ,  H01Q21/28

    摘要： A millimeter-wave (mmWave) assembly (1) comprising a first mmWave module (2), a second mmWave module (3), and a connector (4) configured to releasably interconnect the first mmWave module (2) and the second mmWave module (3). The connector (4) comprises a first connector element (5), associated with the first mmWave module (2). The first mmWave module (2) comprises a first substrate (7) and a mmWave RFIC (8), and the second mmWave module (3) comprises a second substrate (9) and a mmWave antenna array (10). The connector (4) is configured to transmit at least one signal between the mmWave RFIC (8) and the mmWave antenna array (10) when the first mmWave module (2) and the second mmWave module (3) are interconnected. Such a mmWave assembly has a small footprint while still having sufficient radiofrequency performance.

    MILLIMETER-WAVE ASSEMBLY
    6.
    发明公开
    MILLIMETER-WAVE ASSEMBLY 审中-公开

    公开(公告)号：EP4307483A2

    公开(公告)日：2024-01-17

    申请号：EP23213847.9

    申请日：2019-03-04

    申请人： Huawei Technologies Co., Ltd.

    发明人： KHRIPKOV, Alexander ,  LIU, Dong ,  ILVONEN, Janne ,  OU, Jian ,  TIAN, Ruiyuan ,  XU, Changnian ,  HUANG, Wei ,  MILOSAVLJEVIC, Zlatoljub ,  VAN WONTERGHEM, Jari, Kristian

    IPC分类号： H01Q21/28

    摘要： A millimeter-wave (mmWave) assembly (1) comprising a first mmWave module (2), a second mmWave module (3), and a connector (4) configured to releasably interconnect the first mmWave module (2) and the second mmWave module (3). The connector (4) comprises a first connector element (5), associated with the first mmWave module (2). The first mmWave module (2) comprises a first substrate (7) and a mmWave RFIC (8), and the second mmWave module (3) comprises a second substrate (9) and a mmWave antenna array (10). The connector (4) is configured to transmit at least one signal between the mmWave RFIC (8) and the mmWave antenna array (10) when the first mmWave module (2) and the second mmWave module (3) are interconnected. Such a mmWave assembly has a small footprint while still having sufficient radiofrequency performance.