公开(公告)号：EP3835918A1

公开(公告)日：2021-06-16

申请号：EP20194490.7

申请日：2020-09-04

申请人： INTEL Corporation

发明人： DODDI, Raghavendra ,  SRIKANTH, Ravishankar ,  D, Kathiravan ,  KURMA RAJU, Prakash

IPC分类号： G06F1/16 ,  G06F1/20 ,  E05D11/00

摘要： Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.