EXTERNAL COOLING SOLUTION FOR MOBILE COMPUTING DEVICES

    公开(公告)号:EP4123420A1

    公开(公告)日:2023-01-25

    申请号:EP22161808.5

    申请日:2022-03-14

    申请人: INTEL Corporation

    IPC分类号: G06F1/20 H01B7/42

    摘要: An air mover external to a mobile computing device provides enhanced cooling to the device by generating forced air delivered to the device via cooling channels connected to openings in the device chassis. If the mobile computing device is passively cooled (is a fanless device), the enhanced cooling can enable the device or device components to operate at a higher power consumption level without exceeding device/component thermal limits or for features that consume high amounts of power (e.g., fast charging) to be incorporated into the device. The air mover can be integrated into or attached to a cable that provides power to the mobile computing device. The air mover can be powered by the cable. The air mover can dynamically adjust the flow rate of the forced air based on device/component performance information (temperature, power consumption, current consumption) or operational state information of the device.