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    Noncontact testing of integrated circuits
    1.
    发明公开
    Noncontact testing of integrated circuits 失效
    Kontaktloses Testen von integrierten Schaltungen。

    公开(公告)号：EP0196475A1

    公开(公告)日：1986-10-08

    申请号：EP86102791.0

    申请日：1986-03-04

    申请人： International Business Machines Corporation

    发明人： Beha, Johannes Georg ,  Dreyfus, Russell Earren ,  Hartstein, Allan Mark ,  Rubloff, Gary Wayne

    IPC分类号： G01R31/308 ,  H01L23/544

    CPC分类号： G01R31/308 ,  H01L22/14 ,  H01L2924/0002 ,  H01L2924/00

    摘要： tV The method comprising covering metal test pads ( 4 ) of an integrated circuit chip-to-test (11), with a photon-transmissive passivation layer (2) susceptible to photon assisted tunneling, covering the layer (2) with a thin conductive photon- transparent overlayer (3), and then accessing the test pads through the passivation layer and conductive overlayer, by a pulsed laser to provide voltage-modulated photon-assisted tunneling through the insulation layer, to the conductive overlayer as an electron current, and detecting the resulting electron current, thus providing a nondestructive test of integrated circuits. The passivation, normally present to protect the integrated circuit, also lowers the threshold for photoelectron emission. The conductive overlayer acts as a photoelectron collector for the detector. A chip-to-test which is properly designed for photon assisted tunneling testing has test sites accessible to laser photons even though passivated. Such a chip-to-test may be nondestructively tested in air at one or several stages of its processing, without the sacrifices of mechanical probing or of bringing test sites out to output pads.

    摘要翻译： 该方法包括覆盖集成电路芯片到测试（11）的金属测试焊盘（4）和易受光子辅助隧穿影响的光子透射钝化层（2），用薄导电光子覆盖层（2） - 透明的覆盖层（3），然后通过脉冲激光通过钝化层和导电覆层访问测试焊盘，以通过绝缘层提供电压调制的光子辅助隧道作为电子电流的导电覆盖层，并且检测 由此产生的电子电流，从而提供集成电路的非破坏性测试。 通常存在的用于保护集成电路的钝化也降低了光电子发射的阈值。 导电覆盖层用作检测器的光电收集器。 正确设计用于光子辅助隧道测试的芯片对测试即使钝化，激光光子也可以访问测试站点。 这样的芯片到测试可以在其处理的一个或几个阶段的空气中进行非破坏性测试，而不用机械探测的牺牲或将测试点带到输出焊盘。