公开(公告)号：EP1917487A2

公开(公告)日：2008-05-07

申请号：EP06778274.8

申请日：2006-08-17

申请人： International Business Machines Corporation

发明人： KEARNEY, Daniel ,  MARNELL, Mark, Anthony ,  PORTER, Donald, Wayne

IPC分类号： F25B41/06 ,  F25B5/02

CPC分类号： F25B41/062 ,  F25B5/02 ,  F25B2341/0653 ,  F25B2500/04 ,  Y02B30/72

摘要： Systems and Methods of cooling heat generating electronics components are provided employing vapor compression refrigeration. The vapor compression refrigeration system (100) includes a condenser (104), at least one expansion structure (114, 116, 400), at least one evaporator (106, 108), and a compressor (122) coupled in fluid communication to define a refrigerant flow path, and allow the flow of refrigerant therethrough. The at least one evaporator is coupled to the at least one heat generating electronics component to facilitate removal of heat produced by the electronics component (110, 112). A portion of the expansion structure (114, 116, 400) is coated with a polytetraf luorethylene in the refrigerant flow path (430, 450) for inhibiting accumulation of material thereon. The polytetraf luorethylene (PTFE) coating has a thickness sufficient to inhibit accumulation of material in a pressure drop area (450) of the expansion structure without significantly changing a pressure drop characteristic of the pressure drop area.