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公开(公告)号：EP4387389A3
公开(公告)日：2024-07-17
申请号：EP23214801.5
申请日：2023-12-07
发明人： WEI, Naian , WANG, Jianzhuang , JIANG, Zhenlong , LU, Xiangan , WEN, Hao
CPC分类号： H05B3/46 , H05B2203/02120130101 , H05B2203/01320130101 , H05B3/04 , A24F40/46
摘要： The present application provides a heater and an atomization device having the same. The heater includes a heating member having a mounting surface and a covering layer covering the mounting surface. The mounting surface is an uneven low surface energy structure, and the low surface energy structure is at least one of a micron structure and a nanostructure. The ratio of the thickness of the portion of the covering layer with the maximum thickness to the thickness of the portion of the covering layer with the minimum thickness is less than or equal to 3.
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公开(公告)号：EP4387389A2
公开(公告)日：2024-06-19
申请号：EP23214801.5
申请日：2023-12-07
发明人： WEI, Naian , WANG, Jianzhuang , JIANG, Zhenlong , LU, Xiangan , WEN, Hao
CPC分类号： H05B3/46 , H05B2203/02120130101 , H05B2203/01320130101 , H05B3/04 , A24F40/46
摘要： The present application provides a heater and an atomization device having the same. The heater includes a heating member having a mounting surface and a covering layer covering the mounting surface. The mounting surface is an uneven low surface energy structure, and the low surface energy structure is at least one of a micron structure and a nanostructure. The ratio of the thickness of the portion of the covering layer with the maximum thickness to the thickness of the portion of the covering layer with the minimum thickness is less than or equal to 3.
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