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    Thin-film multilayered electrode and method of fabricating same
    2.
    发明公开
    Thin-film multilayered electrode and method of fabricating same 失效
    Dünnfilm-Mehrschichtelektrode und deren Herstellungsverfahren

    公开(公告)号：EP0759642A1

    公开(公告)日：1997-02-26

    申请号：EP96113571.2

    申请日：1996-08-23

    申请人： MURATA MANUFACTURING CO., LTD.

    发明人： Goto, Yoshihiko, Murata Manufact. Co., Ltd. ,  Kobayashi, Masato, Murata Manufact. Co., Ltd. ,  Yoshino, Yukio, Murata Manufact. Co., Ltd. ,  Katayama, Yuzo, Murata Manufact. Co., Ltd.

    IPC分类号： H01P1/203 ,  H01P3/08 ,  H01P3/18 ,  H01P7/08

    CPC分类号： H01P7/082 ,  H01P1/203 ,  H01P3/081 ,  H01P3/18 ,  H05K1/0237

    摘要： A thin-film multilayered electrode (22) of a high frequency electromagnetic field coupled type is disclosed. The thin-film multilayered electrode (22) comprises thin-film conductors (28) and dielectric thin films (24) alternately stacked on a dielectric substrate (21) so that a plurality of TEM mode transmission lines are multilayered. A film thickness of each of the dielectric thin films (24) is set so that phase velocities of TEM waves which propagate through at least two of the plurality of TEM mode transmission lines are made substantially equal to each other, and a film thickness of each of the thin-film conductors (28) is set so as to be smaller than a skin depth of a frequency which is used so that electromagnetic fields of at least two of the plurality of TEM mode transmission lines are coupled with each other. The thin-film conductors (28) include at least one adhesive layer (25) having a large adhesion strength at one or more of interfaces between the dielectric substrate (21) and the thin-film conductor and the interfaces between the thin film conductors (28) and the dielectric thin films (24).

    摘要翻译： 公开了一种高频电磁场耦合型薄膜多层电极（22）。 薄膜多层电极（22）包括交替层叠在电介质基板（21）上的薄膜导体（28）和电介质薄膜（24），使得多个TEM模式传输线是多层的。 设置每个电介质薄膜（24）的膜厚度，使得传播通过多个TEM模式传输线中的至少两个的TEM波的相速度彼此基本相等，并且每个 薄膜导体28被设定为小于使多个TEM模式传输线中的至少两个的电磁场彼此耦合使用的频率的趋肤深度。 薄膜导体（28）包括至少一个在电介质基片（21）和薄膜导体之间的一个或多个界面处的粘附强度和薄膜导体之间的界面（25）的粘附层（25） 28）和电介质薄膜（24）。