公开(公告)号：EP3715427A1

公开(公告)日：2020-09-30

申请号：EP18880940.4

申请日：2018-11-20

申请人： Mitsubishi Materials Corporation

发明人： HIRANO, Koji ,  IIDA, Shintaro ,  SAKURAI, Hideaki

IPC分类号： C09D179/08 ,  C09D5/25 ,  C09D5/44 ,  C25D13/00 ,  C25D13/06 ,  H01B3/30

摘要： A resin for forming an insulating film includes at least one of a modified polyamide-imide having a terminal OH group or a terminal SH group and a modified polyimide having a terminal OH group or a terminal SH group. A varnish includes the resin for forming an insulating film and a solvent. An electrodeposition dispersion includes the resin for forming an insulating film, a polar solvent, water, a poor solvent, and a base. A method for producing an insulated conductor includes: a step of applying the varnish or electrodepositing the electrodeposition dispersion to a surface of a conductor to form a coating layer or an electrodeposition layer on the surface of the conductor; and a step of heating the coating layer or the electrodeposition layer to produce an insulating film and bake the insulating film on the conductor.