摘要:
An apparatus (10) for grinding and/or polishing a surface of a wall element includes a first elongate guide device (30) oriented substantially parallel to the surface of the wall element. A second elongate guide device (36) is movably coupled to the first elongate guide device and oriented orthogonally relative thereto. The second elongate guide device is oriented substantially parallel to the surface of the wall element and moves along the first elongate guide device. A polishing device (62) is movably coupled to the second elongate guide device. The polishing device moves along the second guide device and polishes the surface of the wall element at a plurality of locations along the second guide device and along the first guide device. The invention also relates to a method for grinding and/or polishing a surface of a wall element.
摘要:
A hand tool apparatus uses a cutting tool with a first width and a tool axis to machine a hole in an object. The hole has a second width at least as large as the first width of the cutting tool. The tool axis passes through a predetermined point on a surface of the object. The apparatus includes an actuating assembly including a housing. The housing contains an axial feed mechanism configured for moving the cutting tool in an axial direction, a spindle motor configured for rotating the cutting tool about the tool axis, and a radial offset mechanism. The radial offset mechanism is configured for moving the axial feed mechanism in a radial direction such that the tool axis is offset from a principal axis. A motor is configured for rotating said axial feed mechanism and the cutting tool about the principal axis.
摘要:
An apparatus (10) for grinding and/or polishing a surface of a wall element includes a first elongate guide device (30) oriented substantially parallel to the surface of the wall element. A second elongate guide device (36) is movably coupled to the first elongate guide device and oriented orthogonally relative thereto. The second elongate guide device is oriented substantially parallel to the surface of the wall element and moves along the first elongate guide device. A polishing device (62) is movably coupled to the second elongate guide device. The polishing device moves along the second guide device and polishes the surface of the wall element at a plurality of locations along the second guide device and along the first guide device. The invention also relates to a method for grinding and/or polishing a surface of a wall element.