End termination for chip capacitor
    1.
    发明公开
    End termination for chip capacitor 失效
    连接器,用于芯片设计的电容器。

    公开(公告)号:EP0186765A2

    公开(公告)日:1986-07-09

    申请号:EP85114470.9

    申请日:1985-11-14

    IPC分类号: H01G1/147

    CPC分类号: H01G4/232

    摘要: A monolithic chip capacitor in which the electrode layers are bonded together at an edge. The capacitor includes an electrically conductive substrate that is electrically connected to the bonded edges of the electrode layers. The capacitor body has end terminal surfaces defined by electrically conductive material across one end of the body that is in electrically conducting contact with the substrate. In one form, the termination material is a folded end of the substrate itself. In another form, an end cap which can be thicker than the substrate, is folded to define the termination surface and to provide another surface in good electrical contact with the substrate.

    Miniaturized monolithic multi-layer capacitor and apparatus and method for making
    2.
    发明公开
    Miniaturized monolithic multi-layer capacitor and apparatus and method for making 失效
    小型电动起重机Mehrschichtkondensator sowieGerätund Verfahren zur Herstellung。

    公开(公告)号:EP0147696A2

    公开(公告)日:1985-07-10

    申请号:EP84114923.0

    申请日:1984-12-07

    IPC分类号: H01G13/00 H01G4/30

    摘要: A monolithic multi-layer capacitor is disclosed having a central capacitively active area and two electrode joining sections separated from the active area by sloped sections. The dielectric layers are about 1 micron thick in the active area and taper gradually to zero thickness in the sloped sections. Electrode layers in the active area have a thickness in the range from 200 to 500 Angstroms and sufficient thickness throughout the sloped sections for adequate current carrying capacity. Various acrylates are used for the dielectric layers, the number of layers ranging from a few to many thousands.
    Apparatus and methods are disclosed for the fabrication of such capacitors on a high speed, production scale basis. Such employ techniques for the flash evaporation of highly reactive monomers of acrylate dielectric materials so as to form a gaseous stream of such materials. The gas stream is controllably directed to a deposition surface for condensation and subsequent curing by a field enhanced gas discharge electron beam source. The control of the dielectric gas stream is accomplished by means of adjacent gas streams of an inert gas directed to areas of the deposition surface where deposition of the electrode material is unwanted. Means are disclosed for the atomization of the monomers of the dielectric material in preparation for its flash evaporation.

    摘要翻译: 公开了一种单片多层电容器,其具有中心电容有源面积和两个电极接合部分,通过倾斜部分与有源区域分离。 电介质层在有源区域中约为1微米厚,在倾斜部分逐渐变细至零。 有源区域中的电极层的厚度在200至500埃的范围内,并且在整个倾斜部分具有足够的厚度以具有足够的载流能力。 各种丙烯酸酯用于介电层,层数从几到数千。 公开了用于以高速,生产规模为基础制造这种电容器的装置和方法。 这种采用技术用于快速蒸发丙烯酸酯介电材料的高反应性单体,以形成这种材料的气流。 气流被可控地引导到沉积表面以进行冷凝,然后通过场强气体放电电子束源固化。 电介质气体流的控制是通过相邻的惰性气体气流来实现的,所述惰性气体指向沉积表面的区域,其中电极材料的沉积是不希望的。 公开了为了其闪蒸而准备介电材料的单体的雾化的方法。