公开(公告)号：EP1761992A1

公开(公告)日：2007-03-14

申请号：EP05758580.4

申请日：2005-06-13

申请人： Siemens Power Generation, Inc.

发明人： SMITH, James D., B. ,  STEVENS, Gary ,  WOOD, John, W. ,  LUTZ, Andreas

IPC分类号： H02K3/30 ,  H01B3/00

CPC分类号： C08J5/04 ,  H01B3/12

摘要： The present invention provides for a method of impregnating a matrix with a high thermal conductivity filled resin (32), which produces a resin impregnated matrix. The high thermal conductivity material (30) comprises 5-60% by volume of the resin (32). This is compressed by approximately 5-30%, and the distances between the high thermal conductivity materials loaded in the resin are reduced, and the resin is then cured.

摘要翻译： 本发明提供了一种用高热导率填充树脂32浸渍基质的方法，其产生树脂浸渍基质。 高导热性材料30包含5-60体积％的树脂32.这被压缩大约5-30％，并且装载在树脂中的高热导率材料之间的距离减小，然后树脂被固化 。