CHASSIS MODULE
    1.
    发明公开
    CHASSIS MODULE 审中-公开

    公开(公告)号:EP4040264A1

    公开(公告)日:2022-08-10

    申请号:EP21820886.6

    申请日:2021-05-20

    申请人: ZTE Corporation

    IPC分类号: G06F1/18

    摘要: The present application discloses a chassis module, comprising a chassis and a plurality of first expansion card modules within the chassis. The first expansion card module comprises a first riser card having a plurality of slots and first expansion cards inserted into the first riser card by means of the slots, the plurality of slots being sequentially arranged along the width direction of the first expansion card; the first expansion card comprises a main body part having gold fingers and inserted into the slots along the height direction, and an extension part extending along the length direction from a main body part side edge, and the edge of the first expansion card being provided with a notch extending along two dimensions of the length direction and the height direction; and the first expansion card modules are provided in pairs and arranged adjacent to each other along the length direction, and the extension part of any one of the first expansion cards extends into a notch of the other first expansion card.