利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

186 条记录 (耗时 0.014 秒)

    FULL-SPECTRUM LED LIGHT SOURCE AND MANUFACTURING METHOD THEREFOR
    6.
    发明公开
    FULL-SPECTRUM LED LIGHT SOURCE AND MANUFACTURING METHOD THEREFOR 审中-公开

    公开(公告)号：EP4095907A1

    公开(公告)日：2022-11-30

    申请号：EP20938070.8

    申请日：2020-06-19

    申请人： Zhongshan Mulinsen Electronics Co., Ltd.

    发明人： PI, Baoqing ,  LIU, Jiwei ,  SHI, Hongli

    IPC分类号： H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  F21K9/232 ,  F21K9/90 ,  F21Y115/10

    摘要： The present disclosure relates to the technical field of a light-emitting diode (LED), and specifically provides a full-spectrum LED light source and a manufacturing method thereof. The full-spectrum LED light source includes a bracket, a chipset, and an encapsulation adhesive, where the chipset includes a first blue LED chip with a peak wavelength of 435 nm to 450 nm, a second blue LED chip with a peak wavelength of 450 nm to 460 nm, and a third blue LED chip with a peak wavelength of 460 nm to 475 nm that are connected in series or in parallel. The present disclosure has a good luminous efficiency and a low cost, and can increase values of special color rending indexes (CRIs) R9 and R12 in R1 to R15 to above 90.

    LIGHT EMITTING ELEMENT AND PROCESSING APPARATUS THEREFOR
    8.
    发明公开
    LIGHT EMITTING ELEMENT AND PROCESSING APPARATUS THEREFOR 审中-公开

    公开(公告)号：EP3907425A1

    公开(公告)日：2021-11-10

    申请号：EP21170672.6

    申请日：2021-04-27

    申请人： Ganzhou Hesheng Precision Electronics Co., Ltd.

    发明人： HE, Yaowen

    IPC分类号： F21K9/90 ,  F21S4/10 ,  F21Y115/10

    摘要： Embodiments of the present disclosure provide a light emitting element and a processing apparatus therefor and relate to the technical field of light emitting devices. The light emitting element includes a light-emitting lamp bead(s), a connecting wire, and a covering member(s). The light-emitting lamp bead is welded to the connecting wire to form a welding joint. The covering member covers the light-emitting lamp bead and the welding joint. The covering member is integrally formed by injection molding. The present disclosure solves the technical problem existing in the prior art that the service life is adversely affected and the appearance is deteriorated because the welding joints are oxidized after a period of time.

    LIGHTING MODULE, LIGHTING DEVICE, AND MANUFACTURING METHOD THEREFOR
    9.
    发明公开
    LIGHTING MODULE, LIGHTING DEVICE, AND MANUFACTURING METHOD THEREFOR 审中-公开

    公开(公告)号：EP3904752A1

    公开(公告)日：2021-11-03

    申请号：EP19902863.0

    申请日：2019-12-24

    申请人： LG Innotek Co., Ltd.

    发明人： CHOI, Young Jae

    IPC分类号： F21S2/00 ,  F21K9/90 ,  F21Y115/10

    摘要： A lighting device disclosed in an embodiment of the invention includes a substrate; a light source including a plurality of light emitting devices disposed on the substrate; a resin layer disposed on the substrate; and a first diffusion layer disposed on the resin layer, wherein the resin layer includes a first resin portion disposed on the light source, and a second resin portion adjacent to the first resin portion and disposed on the substrate. The upper surface of the first resin portion has an inclination and is spaced apart from the first diffusion layer, the second resin portion includes a material different from that of the first resin portion, and the second resin portion based on the upper surface of the substrate. The height of the upper surface may be greater than the lowermost height of the upper surface of the first resin portion.