公开(公告)号：EP4416633A1

公开(公告)日：2024-08-21

申请号：EP23743068.1

申请日：2023-01-16

申请人： Rafael Advanced Defense Systems Ltd.

发明人： INGBIR, Ronen ,  BEN-YAKOV, Nave

IPC分类号： G06F30/20 ,  G06F119/14

CPC分类号： G06F2119/1420200101 ,  G06F30/20 ,  G06F30/15

公开(公告)号：EP4350565A1

公开(公告)日：2024-04-10

申请号：EP23198135.8

申请日：2023-09-19

申请人： The Boeing Company

发明人： Brannon, Michael Shawn ,  Gasper, Mark Anthony

IPC分类号： G06F30/15 ,  G06F30/23 ,  G06F119/04 ,  G06F119/10 ,  G06F119/14

摘要： Sonic fatigue analysis is provided. The method comprises developing a finite element model (102) of a structure and calculating, from the finite element model (102), a number of eigenvalues (112) representing fundamental frequencies (106) and mode shapes (108) for the structure. The eigenvalues (112) are mapped to pressure loads (114) applied to the structure in the finite element model (104). Frequency responses from the pressure loads are analysed (118) according to pressure spectral density requirements for the structure (120), and a critical element in the structure is identified according to the frequency responses (122). A frequency response function is plotted for the critical element (122), and an applied stress (128) is calculated according to the frequency response function, wherein the applied stress (128) represents total cumulative stress at the critical element.

公开(公告)号：EP4170539A1

公开(公告)日：2023-04-26

申请号：EP21306482.7

申请日：2021-10-25

申请人： Dassault Systèmes

发明人： SCHMIDT, Martin-Pierre ,  PEDERSEN, Claus Bech Wittendorf ,  BONNER, David Leo

IPC分类号： G06F30/23 ,  G06F111/04 ,  G06F111/10 ,  G06F119/14

摘要： The disclosure notably relates to a computer-implemented method for designing a 3D modeled object representing a transmission mechanism with a target 3D motion behavior. The method comprises providing a 3D finite element mesh and data associated to the mesh, performing a topology optimization based on the mesh and on the associated data, therefore obtaining a density field representing distribution of material quantity of the 3D modeled object. The method further comprises computing a signed field based on the density field and the associated data, identifying one or more patterns of convergence and divergence in the signed field, each pattern forming a region of the signed field, and for each identified pattern, identifying a joint representative of the identified pattern and replacing a part of the density field corresponding to the respective region formed by the identified pattern by a material distribution representing the identified joint.

公开(公告)号：EP4053728A1

公开(公告)日：2022-09-07

申请号：EP21160989.6

申请日：2021-03-05

申请人： Siemens Industry Software NV

发明人： De Weer, Tom

IPC分类号： G06F30/23 ,  G06F113/10 ,  G06F119/14

摘要： A computer-implemented method for modelling variations of repeating parts (VRP) of a component (CMP) comprising. To improve the modelling of components with repeating parts (VRP) with variations additional method steps are proposed as:
A) providing parameter sets (PRM) for part (VRP) configurations (CFG) of a plurality of different of said parts (VRP), wherein said parameters (PRM) of each parameter set (PRM) respectively define the part (VRP) configuration (CFG) of a part (VRP),
B) selecting a selection (SCT) of said part (VRP) configurations (CFG),
C) providing a part (VRP) model (MDL) for each part (VRP) configuration (CFG) of the selection (SCT), wherein said part (VRP) model (MDL) relates forces (FRC) and displacements (DPL) to locations of the respective part (VRP),
D) building an approximator (APX), wherein said approximator (APX) is provided for interpolating said part (VRP) models (MDL) to approximate a part (VRP) model (MDL) of a part (VRP) configuration (CFG) that doesn't belong to said selection (SCT) of said part (VRP) configurations (CFG).

公开(公告)号：EP3989098A1

公开(公告)日：2022-04-27

申请号：EP21785748.1

申请日：2021-06-22

申请人： Tencent Technology (Shenzhen) Company Limited

发明人： CHEN, Yuqin ,  HSIEH, Changyu ,  ZHANG, Shengyu

IPC分类号： G06F30/20 ,  G06F119/10 ,  G06F119/14

摘要： This application provides a quantum noise process analysis method, system, storage medium, and electronic device, which are applied in the field of quantum information processing technology. The method includes: preparing a set of quantum initial states; respectively inputting the quantum initial states into a plurality of first circuits to obtain a plurality of first quantum output states; determining a dynamical map eigenspectrum including a first error according to a functional correspondence between the plurality of first quantum output states and the quantum initial states; respectively inputting the quantum initial states into a plurality of second circuits to obtain a plurality of second quantum output states; determining a dynamical map eigenspectrum including a second error according to a functional correspondence between the plurality of second quantum output states and the quantum initial states; and determining a dynamical map eigenspectrum of the quantum noise process according to the dynamical map eigenspectrum including the first error and the dynamical map eigenspectrum including the second error.

公开(公告)号：EP3016009B1

公开(公告)日：2021-10-13

申请号：EP14818203.3

申请日：2014-06-26

发明人： YONEMURA, Shigeru ,  KUWAYAMA, Takuya ,  UENISHI, Akihiro ,  NIWA, Toshiyuki

IPC分类号： G06F30/20 ,  G06F30/23 ,  G01N3/20 ,  G06F111/10 ,  G06F119/14 ,  G06F113/24

公开(公告)号：EP3879424A1

公开(公告)日：2021-09-15

申请号：EP21156846.4

申请日：2021-02-12

申请人： Tata Consultancy Services Limited

发明人： KALARIYA, Yagnik Pravinchandra ,  SALVI, Amit Gangadhar ,  BASAVARSU, Purushottham Gautham

IPC分类号： G06F30/20 ,  G06F30/23 ,  G06F111/10 ,  G06F113/22 ,  G06F113/26 ,  G06F119/14

摘要： Conventional approaches of physical experiments for the effects of cure kinetics in composites materials may lack in capturing lower length scale effects at bulk level. The computational state of the art approaches has not focused on the issue of scale bridging between multiple length scales for manufacturing effects in composites. This limits its usability for specific materials or situations. Embodiments of the present disclosure provide systems and methods that implement a multiscale analysis for determining residual stress and deformation profiles in molded parts comprising composite material. More specifically, present disclosure implements the multiscale analysis wherein a thermal chemical analysis and thermal mechanical analysis are linked to achieve two-way coupling for curing effects at each node/point of molded parts having composite material to provide flexibility and versatility in terms of exploring multiple material combinations without major modification in the approach.

公开(公告)号：EP3871130A2

公开(公告)日：2021-09-01

申请号：EP19886046.2

申请日：2019-10-28

申请人： Arris Composites Inc.

发明人： ESCOWITZ, Ethan ,  PERKINS, J. Scott ,  REESE, Riley ,  DAVIDSON, Erick ,  HENNESSEE, Sean

IPC分类号： G06F30/17 ,  G06F30/23 ,  B29C70/30 ,  B29C70/46 ,  B29C70/54 ,  G06F111/04 ,  G06F113/22 ,  G06F119/14 ,  G06F119/18 ,  G06F113/24 ,  G06F113/26

公开(公告)号：EP3786832A1

公开(公告)日：2021-03-03

申请号：EP20181718.6

申请日：2020-06-23

申请人： The Boeing Company

发明人： BEHZADPOUR, Forouzan ,  STICKLER, Patrick Bickford

IPC分类号： G06F30/12 ,  G06F30/20 ,  G06F30/27 ,  G06F113/26 ,  G06F119/14

摘要： A method, apparatus, and system for managing a composite part (104). An acceptable level (114) of a warpage (116) is identified for the composite part (104). The warpage (116) for the composite part (104) is a change in the composite part (104) as manufactured that deviates from design specifications (119) for the composite part (104). Orientations (118) in a stacking sequence (120) for plies (122) in the composite part (104) are selected that result in the composite part (104) having the acceptable level (114) of the warpage (116) and a desired strength (124) to form selected orientations (126). The composite part (104) is manufactured using the selected orientations (126).

公开(公告)号：EP4451166A1

公开(公告)日：2024-10-23

申请号：EP23168206.3

申请日：2023-04-17

申请人： Siemens Aktiengesellschaft

发明人： Fischer, Jan ,  Liebig, Veronika ,  Paffrath, Meinhard ,  Ullmann, Florian

IPC分类号： G06F30/23 ,  G06F30/27 ,  G06F111/04 ,  G06F119/14

摘要： Es wird ein digitales Produktmodell (PM) eingelesen, das Bauteile des Produkts (P) hinsichtlich ihrer räumlichen Geometrie und räumlichen Anordnung im Produkt (P) in Form von virtuellen Bauteilen (B, B1, B2, SH) spezifiziert. Erfindungsgemäß wird ein jeweiliges virtuelles Bauteil (B, B1, B2, SH) im Produktmodell (PM) virtuell bewegt, währenddessen ein Verlauf (OP) einer Überlappung des bewegten virtuellen Bauteils mit mindestens einem anderen virtuellen Bauteil des Produkts (P) ermittelt wird. Weiterhin wird mittels einer Mustererkennung (ME) geprüft, ob der ermittelte Überlappungsverlauf (OP) einem Verlaufsmuster (VM) einer Schnappverbindung entspricht. Bei positivem Prüfungsergebnis wird dann aus der virtuellen Bewegung des jeweiligen virtuellen Bauteils eine Fügeoperation (FO) abgeleitet, und es wird eine Simulation der Fügeoperation (FO) durchgeführt, durch die eine Deformation (D) des jeweils bewegten virtuellen Bauteils und/oder des mindestens einen anderen virtuellen Bauteils sowie eine zur Deformation (D) erforderliche Fügekraft (F) ermittelt werden. Die Fügeoperation (FO) wird dann mit der ermittelten Fügekraft (F) als Montageoperation (MO) zur Montage des Produkts (P) ausgegeben.