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    PLATE MATERIAL CUTTING DEVICE
    9.
    发明公开
    PLATE MATERIAL CUTTING DEVICE 审中-公开

    公开(公告)号：EP4082704A1

    公开(公告)日：2022-11-02

    申请号：EP20905985.6

    申请日：2020-12-21

    申请人： Sankyo Seisakusho Co.

    发明人： SUZUKI, Kengo

    IPC分类号： B23D15/04 ,  B23D15/08 ,  B23D35/00

    摘要： To provide a plate material cutting device of which thickness can be reduced and made compact. A plate material cutting device 101 includes: a first cutting blade 103 fixed to a housing 102; a second cutting blade 104 that cuts plate material collaboratively with the first cutting blade 103; and a drive unit that causes the second cutting blade 104 to reciprocally move with respect to the first cutting blade 103, wherein the drive unit includes: a shaft 105 that is rotatable on a rotational axis 106; a first motor 107 connected to one end portion of the shaft 105; a first mechanism that is capable of causing the second cutting blade 104 to reciprocally move with respect to the first cutting blade 103 in conjunction with rotation of the shaft 105 on the rotational axis 106; and a second mechanism that is capable of supporting a load onto the shaft 105 at a time of cutting plate material.