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公开(公告)号:EP4085789B1
公开(公告)日:2024-05-22
申请号:EP22173456.9
申请日:2020-10-28
IPC分类号: A45C11/00 , H04B1/3888 , H04M1/18 , G06F1/16
CPC分类号: A45C11/00 , A45C2011/00220130101 , A45C2011/00320130101 , H04B1/3888 , H04M1/185 , G06F1/1626 , G06F1/1656 , G06F2200/163320130101
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公开(公告)号:EP3899700B1
公开(公告)日:2024-05-22
申请号:EP20758610.8
申请日:2020-02-19
IPC分类号: G06F1/16 , G09G3/00 , G09G3/20 , H04B1/3888 , H04M1/02
CPC分类号: H04B1/3888 , G09G2340/040720130101 , G09G2354/0020130101 , G09G3/20 , G09G2300/02620130101 , H04M1/0243 , H04M1/0216 , H04M1/0268 , G06F1/1641 , G06F1/1681 , G06F1/1652 , G06F1/1647 , G06F1/165 , G06F1/1677 , G06F2203/0410220130101 , G09G3/035
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公开(公告)号:EP3785255B1
公开(公告)日:2024-03-06
申请号:EP19727110.9
申请日:2019-04-24
发明人: BØHN, Mads
IPC分类号: G10K11/16 , H04B1/3888 , H04R1/34
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公开(公告)号:EP4272419A1
公开(公告)日:2023-11-08
申请号:EP21851913.0
申请日:2021-12-28
发明人: WRIGHT, Joshua , LAI, June
IPC分类号: H04M1/03 , A45C11/00 , H04B1/3888 , H04M1/18
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公开(公告)号:EP4270797A2
公开(公告)日:2023-11-01
申请号:EP23192722.9
申请日:2020-04-14
发明人: Lee, Taeyun , Kim, Yongyoun , Kim, Haeyeon , Lee, Taekyung , Yang, Dongil , Na, Hyoseok , Lee, Soyoung
IPC分类号: H04B1/3888
摘要: In an embodiment, an electronic device may include a housing including a hinge module, a first housing, and second housing. The first and second housings are rotatably coupled to each other via the hinge module to be in a folded state or an unfolded state. The electronic device may further include at least one conductive pattern disposed in the first housing; at least one conductor's conductive pad, electrically connected to a corresponding at least one conductor disposed at a first position in the second housing corresponding to the at least one conductive pattern such that the at least one conductor's conductive pad is capacitively coupled to the at least one conductive pattern when the electronic device is in the folded state; and a wireless communication circuit electrically connected to the at least one conductive pattern in the first housing, wherein when the electronic device is in the unfolded state, the at least one conductor's conductive pad is disconnected from the at least one conductive pattern such that the at least one conductor's conductive pad is disconnected from the wireless communication circuit.
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公开(公告)号:EP3137175B1
公开(公告)日:2023-06-21
申请号:EP15785330.0
申请日:2015-04-29
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公开(公告)号:EP4063997B1
公开(公告)日:2023-05-10
申请号:EP21182305.9
申请日:2021-06-29
发明人: PANG, Chenglin
IPC分类号: H04B1/3888 , H04M1/03 , G06F1/16 , H04R1/02 , H04R1/34
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公开(公告)号:EP3813343B1
公开(公告)日:2023-04-12
申请号:EP19821950.3
申请日:2019-05-14
发明人: KIM, Yongyoun , SEOL, Kyungmoon , LEE, Minsung , JUNG, Jinwoo , LEE, Soyoung , CHUN, Jaebong
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公开(公告)号:EP3701325B1
公开(公告)日:2023-01-04
申请号:EP19728770.9
申请日:2019-04-23
发明人: BUSHNELL, Tyler, S.
IPC分类号: G02F1/1333 , G04G9/00 , G04G9/04 , G04G21/08 , G06F1/16 , H01L51/00 , H01L51/52 , H04B1/3888 , H01L27/32 , H04B1/3827
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