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3242 条记录 (耗时 0.032 秒)

    CERAMIC SINTERED BODY, INSERT, CUTTING TOOL, AND FRICTION STIR WELDING TOOL
    13.
    发明公开
    CERAMIC SINTERED BODY, INSERT, CUTTING TOOL, AND FRICTION STIR WELDING TOOL 审中-公开

    公开(公告)号：EP3689839A1

    公开(公告)日：2020-08-05

    申请号：EP18863044.6

    申请日：2018-09-18

    申请人： NGK Spark Plug Co., Ltd.

    发明人： KOJIMA, Yoshito ,  YONEKURA, Hiroshi ,  KATSU, Yusuke ,  MITSUOKA, Takeshi

    IPC分类号： C04B35/56 ,  B23B27/14 ,  C04B41/87

    摘要： Provided is a ceramic sintered body having high wear resistance and chipping resistance. Also provided are an insert, a cutting tool and a friction stir welding tool, each of which uses such a high-performance ceramic sintered body. The ceramic sintered body includes Al 2 O 3 (alumina), WC (tungsten carbide) and ZrO 2 (zirconia), wherein Zr (zirconium) element is present at either one or both of: (1) a grain boundary between crystal grains of the Al 2 O 3 ; and (2) a grain boundary of crystal grains of the Al 2 O and crystal grains of the WC, wherein the ceramic sintered body contains 55.0 to 97.5 vol% of the WC, 0.1 to 18.0 vol% of the ZrO 2 , and the balance being the Al 2 O 3 , and wherein the ZrO 2 is in a phase of tetragonal structure (T) or a mixed phase of tetragonal structure (T) and monoclinic structure (M).

    WIRING BOARD
    18.
    发明公开
    WIRING BOARD 审中-公开

    公开(公告)号：EP3634093A1

    公开(公告)日：2020-04-08

    申请号：EP18806598.1

    申请日：2018-05-11

    申请人： NGK Spark Plug Co., Ltd.

    发明人： HAYASHI, Takahiro ,  HANDO, Takuya

    IPC分类号： H05K3/46

    摘要： Provided are: a wiring board in which, even when a plurality of via conductors are arranged in parallel for each of a plurality of pads opposing each other with an insulating layer therebetween, a crack is not prone to occur in the insulating layer due to the arrangement of the plurality of via conductors; and a method for manufacturing the same. The wiring board 1 is provided with: a board body 2 which is made up of a plurality of insulating layers c1 to c5 and includes an upper surface 3 and a lower surface 4 opposing each other; a plurality of pads 5 to 7 formed on at least one of the upper surface 3, the lower surface 4, and an inner layer surface 9; and a plurality of via conductors 8 which are respectively connected to the plurality of pads 5 to 7 of the board body 2 and formed in parallel along the thickness of the board body 2. In the board body 2, the plurality of via conductors 8 are connected to a plurality of pads 5 to 7 adjacent to each other on the same surfaces 3, 4, 9 in plan view, wherein the arrangement of the plurality of via conductors 8 differs among the adjacent pads 5 to 7 on the same surfaces 3, 4, 9 in plan view.