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公开(公告)号:EP3777236A1
公开(公告)日:2021-02-17
申请号:EP19717705.8
申请日:2019-04-02
申请人: Apple Inc.
发明人: SIAHAAN, Edward , BLOOM, Daniel R. , PANECKI, Lee M. , QIAN, Phillip , SHAFFER, Benjamin A. , STRINGER, Christopher J. , WHANG, Eugene A. , NARAJOWSKI, David H. , OSHITA, Scott Y. , HATFIELD, Dustin A. , SEGRAVES, Zachary G. , DOCHERTY, Sean J.
IPC分类号: H04R5/033
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公开(公告)号:EP3629593A1
公开(公告)日:2020-04-01
申请号:EP19200553.6
申请日:2019-09-30
申请人: Apple Inc.
发明人: MCINTOSH, Sean T. , DELLA ROSA, Jason C. , PARKER, Samuel G. , COUSINS, Benjamin A. , HUWE, Ethan L. , GRINKER, Scott , ANDERSEN, Esge , STANLEY, Craig M. , JUHNKE, Ethan W , SIAHAAN, Edward , ZHANG, Mei , TWEHUES, Brian R. , HUA, Thanh P , SANG, Haochuan , CHAWAN, Arun D , PANECKI, Lee M , LEBLANC, Jason J. , JI, Qigen , GHAHRI SARABI, Mohammad Soroush , HAO, Zhu
摘要: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.
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