摘要:
The invention relates to a device for determining the stress placed upon and/or the state of a tool or of a cutting tool. To this end, the invention provides that a thin-layer sensor is provided in the area of chucking, with which a position change in position can be measured. The invention also relates to a method for determining the stress placed upon and/or the state of a tool during which a change in position is measured by a thin-layer sensor in order to determine the stress placed upon the tool or the state thereof.
摘要:
The invention relates to a device for determining the stress placed upon and/or the state of a tool or of a cutting tool. To this end, the invention provides that a thin-layer sensor is provided in the area of chucking, with which a position change in position can be measured. The invention also relates to a method for determining the stress placed upon and/or the state of a tool during which a change in position is measured by a thin-layer sensor in order to determine the stress placed upon the tool or the state thereof.