公开(公告)号：EP3534196A1

公开(公告)日：2019-09-04

申请号：EP16922499.5

申请日：2016-11-25

申请人： Huawei Technologies Co., Ltd.

发明人： GAO, Lei ,  SONG, Xiaolu ,  DONG, Zhen ,  ZHAO, Qing ,  ZENG, Li

IPC分类号： G02B6/42 ,  H01L23/02

摘要： An optical component packaging apparatus, an optical module, and an optical component packaging method are disclosed, to resolve a prior-art problem that an optical component packaging apparatus can implement neither hermetic package of an optical component with low costs nor optical coupling of the optical component. The optical component packaging apparatus includes an optical component, and further includes two packaging substrates disposed opposite to each other. A packaging cavity filled with a protective gas is formed between the two packaging substrates, and the optical component is disposed in the packaging cavity. At least one packaging substrate is provided with an optical waveguide. An end face of a first coupling end of each optical waveguide is disposed on an inner surface of the packaging cavity and is coupled to the optical component. An end face of a second coupling end of each optical waveguide is disposed on a surface that is of a corresponding packaging substrate and that is located outside the packaging cavity. Based on the optical component packaging apparatus, a problem of hermetic package of the optical component with low costs and a problem of the optical coupling of the optical component are resolved.