Semiconductor device and manufacturing method thereof
    11.
    发明公开
    Semiconductor device and manufacturing method thereof 有权
    Halbleitervorrichtung und Verfahren zu deren Herstellung

    公开(公告)号:EP1519419A2

    公开(公告)日:2005-03-30

    申请号:EP04022463.6

    申请日:2004-09-21

    摘要: An aspect of the present invention provides a semiconductor device that includes a first conductivity type semiconductor body, a source region in contact with the semiconductor body, whose bandgap is different from that of the semiconductor body, and which forms a heterojunction with the semiconductor body, a gate insulating film in contact with a portion of junction between the source region and the semiconductor body, a gate electrode in contact with the gate insulating film, a source electrode, a low resistance region between and in contact with the source electrode and the source region, and connected ohmically with the source electrode, and a drain electrode connected ohmically with the semiconductor body.

    摘要翻译: 本发明的一个方面提供了一种半导体器件,其包括第一导电类型半导体本体,与半导体本体接触的源极区,其带隙与半导体本体的带隙不同,并且与半导体本体形成异质结, 与源极区域和半导体本体之间的接合部分接触的栅极绝缘膜,与栅极绝缘膜接触的栅极电极,源极电极,与源极电极和源极接触的低电阻区域 并且与源电极欧姆连接,以及与半导体本体欧姆连接的漏电极。