公开(公告)号：EP3435685A1

公开(公告)日：2019-01-30

申请号：EP16895020.2

申请日：2016-05-24

申请人： Goertek Inc

发明人： ZHAO, Guodong ,  JI, Pengcheng ,  YANG, Xinfeng

IPC分类号： H04R7/06 ,  H04R31/00

摘要： Disclosed in the present invention is a diaphragm and a manufacturing method for a diaphragm, the diaphragm comprising an annular support member, a first diaphragm layer and a circuit layer, the first diaphragm layer being fixedly connected to a support body of the annular support member, the circuit layer being positioned on the surface of a vibrating sound coil adjacent to the first diaphragm layer and being fixedly connected to the first diaphragm layer and the support body, the circuit layer being provided with a circuit area, a capacitance area, and a capacitance solder pad, the capacitance area being a capacitance electrode plate formed on the first diaphragm layer, the capacitance area being in communication with the circuit area by means of the capacitance solder pad, and the solder pad corresponding to the support body. In the present invention, the capacitance electrode plate is positioned directly on the circuit layer, the annular support member supports the first diaphragm layer and the circuit layer, and the solder pad corresponds to the support body, such that an acquisition lead connected to the capacitance solder pad will not break as a result of vibrating with the membrane, thus ensuring the reliability of capacitance data acquisition.