公开(公告)号：EP3435636A1

公开(公告)日：2019-01-30

申请号：EP18151313.6

申请日：2018-01-12

申请人： LG Electronics Inc.

发明人： KIM, Dongjin ,  KANG, Yunmo ,  KWON, Youngbae ,  JUNG, Kangjae ,  RHYU, Hanphil

IPC分类号： H04M1/02 ,  H01Q1/24 ,  G06F1/20 ,  G06F1/16

摘要： A mobile terminal can include a frame including a middle portion and an edge portion that includes conductive members and is located outside of the middle portion; a slot antenna including a slot with an open end, at least one of the conductive members, a ground unit and the middle portion of the frame; a display unit on a front surface of the middle portion; and a heat radiation sheet between a back surface of the display unit and the front surface of the middle portion, in which the back surface includes a first region overlapping the middle portion of the frame, a second region located outside of an edge of the middle portion of the frame without overlapping the middle portion, a third region overlapping the heat radiation sheet, and a fourth region including part of the second region that overlaps the slot without overlapping the heat radiation sheet.

公开(公告)号：EP2913935B1

公开(公告)日：2018-09-05

申请号：EP13888701.3

申请日：2013-12-16

申请人： LG Electronics Inc.

发明人： KIM, Changil ,  KIM, Dongjin ,  YOUN, Yeomin ,  YOON, Hyeongsik ,  LEE, Jaegon ,  YOU, Chisang

IPC分类号： H04B1/38 ,  H01Q1/48

CPC分类号： H04B1/3888 ,  H01Q1/243 ,  H01Q1/42 ,  H01Q1/44 ,  H04B15/005 ,  H04M1/0274

摘要： A mobile terminal, comprises: a case including a conductive metal part; a main board mounted inside the case and having a power supply part and a ground surface; a first antenna radiator disposed so as to be spaced from the power supply part to the first antenna radiator; a power supply line for electrically connecting the power supply part to the first antenna radiator and ground line for electrically connecting the ground surface to the metal part and the first antenna radiator, thereby preventing a decrease in the performance of an antenna since the formation of an electromagnetic field between the case of a metallic material and the main board can be minimized even if the metallic material is used for the case.