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公开(公告)号:EP3520731B1
公开(公告)日:2021-07-14
申请号:EP17856085.0
申请日:2017-09-26
Inventor: KIKKAWA, Tasuku , SHIRAKI, Narutomo , KUSAKABE, Noboru
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公开(公告)号:EP3816234A1
公开(公告)日:2021-05-05
申请号:EP19824980.7
申请日:2019-06-18
Applicant: Nitto Denko Corporation
Inventor: SUGINO Yusuke , IMOTO Takashi , KAWANISHI Daisuke , KINOSHITA Mayu
Abstract: Provided is a novel flame retardant material excellent in flame retardancy. A flame retardant material according to one embodiment of the present invention is formed from a resin composition (A) including a binder resin, a low-melting point inorganic substance, and a high-melting point inorganic substance. A flame retardant material according to another embodiment of the present invention is formed from a resin composition (B) including a binder resin that produces a high-melting point inorganic substance when heated, and a low-melting point inorganic substance.
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公开(公告)号:EP3761355A1
公开(公告)日:2021-01-06
申请号:EP19757161.5
申请日:2019-02-25
Applicant: Denka Company Limited
Inventor: WADA,Kosuke , YAMAGATA,Toshitaka , KANEKO,Masahide
Abstract: Provided is an insulating heat dissipation sheet which has both high thermal conductivity and high insulating properties, particularly that suitable for use as a heat dissipation member for electronic components.
An insulating heat dissipation sheet, comprising hexagonal boron nitride and a silicone resin, wherein the particle size frequency distribution of the hexagonal boron nitride has maximal peaks in a range of 35 to 100 µm, and in a range of 10 to 25 µm and/or in a range of 0.4 to 5 µm; the average particle size of the hexagonal boron nitride is in a range of 30 to 80 µm; and the insulating heat dissipation sheet comprises a silicone composition containing the hexagonal boron nitride in a content of 40 to 70% by volume and the silicone resin in a content of 30 to 60% by volume.-
公开(公告)号:EP3728473A1
公开(公告)日:2020-10-28
申请号:EP18816086.5
申请日:2018-12-17
Applicant: EMS-Patent AG
Inventor: STÖPPELMANN, Georg
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公开(公告)号:EP3727802A1
公开(公告)日:2020-10-28
申请号:EP18910701.4
申请日:2018-03-21
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: QUEROL ESPARCH, Maria del Carmen , HERSCHKE, Laurent
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公开(公告)号:EP3347319B1
公开(公告)日:2020-10-28
申请号:EP16775015.7
申请日:2016-09-06
Applicant: 3M Innovative Properties Company
Inventor: WILDING, Matthew D. , LIEDER, Stephen L. , CARLSON, Eugene H. , BUDD, Kenton D. , ENGEBRETSON, Joseph D.
IPC: C03C12/02 , C09D123/08 , C09D123/14 , E01F9/524 , G02B5/128 , C08K3/013 , C08K3/40 , C08L23/08 , C08L23/14 , C08L51/06
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公开(公告)号:EP3725833A1
公开(公告)日:2020-10-21
申请号:EP19169464.5
申请日:2019-04-16
Applicant: EMS-Patent AG
Inventor: AEPLI, Etienne
Abstract: Polyamid-Formmasse bestehend aus den Komponenten
(A) 28.0-64.9 Gew.-% wenigstens eines Polyamids,
(B) 15.0-40.0 Gew.-% Glasfasern,
(C) 15.0-35.0 Gew.-% Glasflakes mit einer Teilchendicke im Bereich von 0.3 - 2.0 µm,
(D) 0.1-2.0 Gew.-% Hitzestabilisator,
(E) 0-5.0 Gew.-% Additive
mit der Massgabe, dass die Summe der Komponenten (B) und (C) im Bereich von 35.0 bis 65.0 Gew.-% liegt, bezogen auf die Summe der Komponenten (A) bis (E), und die Summe der Komponenten (A) bis (E) 100 Gew.-% ergibt.-
公开(公告)号:EP3315553B1
公开(公告)日:2020-09-30
申请号:EP16817553.7
申请日:2016-04-27
Applicant: Toray Industries, Inc.
Inventor: WATANABE, Kei , TAKEDA, Kazusada , NISHIMURA, Yosuke , TAKEZAKI, Hiroshi , MIYAMA, Hisashi , NISHIDA, Mikiya
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公开(公告)号:EP3088472B1
公开(公告)日:2020-09-23
申请号:EP16167057.5
申请日:2016-04-26
Applicant: Craze GmbH
Inventor: Aschenbrenner, Michael , Lipp, Florian N.
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公开(公告)号:EP3467016B1
公开(公告)日:2020-09-09
申请号:EP17802631.6
申请日:2017-05-16
Applicant: Nippon Sheet Glass Company, Limited
Inventor: KATO, Shinichi , TAI, Nobuaki
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