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公开(公告)号:EP0204417A2
公开(公告)日:1986-12-10
申请号:EP86303119.1
申请日:1986-04-24
IPC分类号: H01B3/18 , C10M123/04
CPC分类号: H01B3/18 , Y10S524/906 , Y10S525/939
摘要: @ A gelled dielectric encapsulant material and process therefor for use in reenterable and nonreenterable communication cable splices as well as applications relating to encapsulation of electronic components comprises a plasticizer which does not stress crack polycarbonate, an aliphatic or aromatic carboxylic acid, and a basic oxide or hydroxide.