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公开(公告)号:EP3687367B1
公开(公告)日:2023-02-15
申请号:EP18769387.4
申请日:2018-09-21
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公开(公告)号:EP4064468A1
公开(公告)日:2022-09-28
申请号:EP20888784.4
申请日:2020-08-25
申请人: KDDI Corporation
发明人: WAKAYAMA Yuta , TSURITANI Takehiro
摘要: An optical coupler includes first to Nth members, wherein a Kth (K is an integer of 1 to N) member includes a MC optical fiber including first to Pth (P is an integer of N or greater) cores disposed at regular intervals in a circular shape, and a marker disposed at a position closest to the first core, and at least one SC optical fiber, a core of the SC optical fiber of the Kth member is coupled to a coupled core that is other than the first core, cores of the MC optical fiber of an Mth (M is an integer of 1 to N-1) member are connected to cores of the MC optical fiber of an (M+1)th member, a total number of SC optical fibers included in the first to Nth members is P, and each of P cores of the MC optical fibers configured through the connection of the first to Nth members is connected to a core of one of the P SC optical fibers included in the first to Nth members.
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公开(公告)号:EP4062214A1
公开(公告)日:2022-09-28
申请号:EP20804598.9
申请日:2020-11-18
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公开(公告)号:EP4020030A1
公开(公告)日:2022-06-29
申请号:EP21209148.2
申请日:2021-11-18
申请人: INTEL Corporation
发明人: PRATAP, Divya , NEKKANTY, Srikant
摘要: Embodiments described herein may be related to apparatuses, processes, and techniques related to active optical couplers that provide optical coupling at or proximate to an edge of a silicon photonics package, to allow the package to optically couple with other devices or peripherals. In embodiments, the active optical coupler is optically coupled with a photonics IC (PIC) inside the photonics package, and provides an optical coupling mechanism for optical pathways outside the photonics package. The active optical coupler may include electrical circuitry and may be coupled to the package substrate to provide data related to the operation of the active optical coupler. Other embodiments may be described and/or claimed.
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公开(公告)号:EP4012852A1
公开(公告)日:2022-06-15
申请号:EP20852258.1
申请日:2020-06-22
申请人: Fujikura Ltd.
发明人: MATSUMOTO, Ryokichi
摘要: In an optical combiner, deformation in the cross section of a predetermined first optical fiber is reduced more than in conventional optical combiners. The optical combiner (10) includes: an optical fiber bundle (11) formed by a plurality of first optical fibers (111 to 117); and a second optical fiber (12) having a diameter equal to or larger than the diameter of the optical fiber bundle (11). The plurality of first optical fibers (111 to 117) include a predetermined first optical fiber (117) and the other first optical fibers (111 to 116), the predetermined first optical fiber (117) being composed of one or more materials having higher softening temperatures than one or more materials for the other first optical fibers (111 to 116).
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公开(公告)号:EP3996219A1
公开(公告)日:2022-05-11
申请号:EP20835462.1
申请日:2020-03-24
申请人: Fujikura Ltd.
发明人: TAYA, Hiroyuki
摘要: For an optical device including an upstream optical fiber and a downstream optical fiber, this invention has an object to reduce, in a case where optical fiber fuse occurs in the downstream optical fiber, the influence of the optical fiber fuse that can be given to the upstream optical fiber. An optical fiber fuse protection device (10) includes an upstream optical fiber (output port OP) disposed on an upstream side, a downstream optical fiber (output delivery fiber ODF) fusion-spliced to the upstream optical fiber (output port OP), and a wall (partition wall Pa) interposed between the upstream optical fiber (output port OP) and the downstream optical fiber (output delivery fiber ODF).
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公开(公告)号:EP3995872A1
公开(公告)日:2022-05-11
申请号:EP21207039.5
申请日:2021-11-09
发明人: HE, Junwen , VAN CAMPENHOUT, Joris , VAN STEENBERGE, Geert , MISSINNE, Jeroen , YILMAZ, Yigit , KIM, Do Won , LA TULIPE, Douglas Charles
摘要: The present disclosure relates to silicon-based photonic chips, in particular, for optically coupling to an optical fiber or optical fiber assembly, and a method for fabricating the same. The photonic chip of the disclosure comprises a single-mode waveguide configured to guide light and provide a light beam. Further, the photonic chip comprises a first optical element configured to expand the light beam in a first direction in-plane of the photonic chip, in order to provide an expanded light beam. The photonic chip also comprises a second optical element configured to deflect and at the same time further expand the expanded light beam in a second direction, in order to provide an output light beam from the photonic chip.
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公开(公告)号:EP3371635B1
公开(公告)日:2022-05-04
申请号:EP17869511.0
申请日:2017-11-08
发明人: DANZIGER, Yochay , FRIEDMANN, Edgar
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公开(公告)号:EP3987331A1
公开(公告)日:2022-04-27
申请号:EP20735288.1
申请日:2020-06-19
发明人: THEEG, Thomas , PULZER, Tony
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