摘要:
An elastomer composition for light-resistant covering materials, and covering materials for industrial parts which comprise the composition, are obtainable by partially cross-linking a mixture comprising (A) 100 parts by weight in total of at least one terpolymer rubber having a 100°C Mooney viscosity (ML₁₊₄ 100°C) of 30 to 350 selected from ethylene-propylene-dicyclopentadiene terpolymer rubbers and ethylene-butene-1-dicyclopentadiene terpolymer rubbers, (B) 5 to 150 parts by weight of an olefinic polymer and (C) 0 to 150 parts by weight of a mineral oil or a mixture comprising 40 to 95% by weight of an oil-extended ethylene terpolymer rubber and 5 to 60% by weight of an olefinic polymer, the oil-extended ethylene terpolymer rubber comprising a terpolymer rubber component comprising at least one ethylene terpolymer rubber having a 100°C Mooney viscosity (ML₁₊₄ 100°C) of 30 to 350 ethylene propylene-dicyclopentadiene terpolymer rubbers and ethylene-butene-1-dicyclopentadiene terpolymer rubbers and 150 parts by weight or less of a mineral oil per 100 parts by weight of the terpolymer rubber component.
摘要:
A thermoplastic elastomer composition which comprises a mixture comprising: (A) 20 to 50 parts by weight of an olefinic copolymer rubber; (B) 50 to 80 parts by weight of an olefinic plastic having a melt index ratio M₁:M₀ of 2:1 to 50:1 wherein M₀ is the melt index of the plastic before being subjected to a thermal decomposition in the presence of an organic peroxide and M₁ is the melt index of the plastic after being subjected to a thermal decomposition in the presence of an organic peroxide, the sum of (A) and (B) being 100 parts by weight; (C) 5 to 25 parts by weight of a mineral oil; (D) 0.1 to 3 parts by weight of a bismaleimide compound; and (E) an organic peroxide.
摘要:
A novel thermoplastic resin composition comprising a matrix of polyamide resin (E) and a disperse phase of a composition (D), said composition (D) comprising a polyphenylene ether (A), a rubber-like material (B) and a mutual compatibilizer (C), said polyphenylene ether (A) being obtained from at least one phenol compound represented by the formula: wherein R₁, R₂, R₃, R₄ and R₅ represent a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue, with a proviso that at least one of them is a hydrogen atom, and said polyphenylene ether (A) having a reduced viscosity η sp/c of 0.40 - 0.58 deciliter/gram, said mutual compatibilizer (C) being compatible or reactive with said polyphenylene ether and reactive with said polyamide resin, and said polyamide resin (E) having a number average molecular weight of 14,000 - 40,000 and an end amino group content of 50 - 95 mmole/kg, wherein the thermoplastic resin composition constitutes 1 - 65 wt.% of said polyphenylene ether (A), 1 - 20 wt.% of said rubber-like material (B), 0.01 - 5 wt.% of said mutual compatibilizer (C) and 35 - 97.99 wt.% of said polyamide resin (E), based on the total weight of said thermoplastic resin composition, and the weight average particle size of said disperse phase is 2 micron or less.